| 摘要 |
PURPOSE:To prevent unexpected accidents such as contact of terminals, by bending external connecting terminals so that the connecting terminals are overlapped, and improving the strength without shortening the distance between the terminals. CONSTITUTION:Leads 4 and 5 are bent in an overlapped state. Tip parts 4a and 5a of the leads are compressed to the base parts of the leads 4 and 5 by a package 6. As a result, the mechanical strengths of the leads 4 and 5 become approximately twice, but the area observed from the upper part is not changed. Therefore, the strengths of the leads can be improved without changing the intervals between the leads 4 and 5 and the neighboring other leads. Thus the integration degree of an IC chip 2 is improved. Even if the number of the leads is increased thereby, accidents such as contact between the leads can be decreased. |
