| 摘要 |
PURPOSE:To prevent charging of a package and to decrease electrostatic breakdown of a semiconductor device, by forming conductor layers around the outer surface of the package, and a grounding said semiconductor layers through a GND terminal or a unused terminal of the semiconductor device. CONSTITUTION:A conductor layer 3 is provided on the upper surface of a package 2 of an IC1. A conductor layer 4 is provided at the lower surface. Both layers are connected at a position where an unused terminal 5 is provided. The unused terminal 5 and the conductor layers 3 and 4 are electrically connected as a unitary body. External connecting terminals 6 are individually insulated by the package 2. The IC1 such as this is enclosed in a magazine and carried. At this time one end of the magazine is connected. Thus the conductor layers 3 and 4 are grounded through the unused terminal 5. Therefore, charging of the package 2 is prevented, and the electrostatic breakdowns of the IC1 can be decreased. |
