| 摘要 |
PURPOSE:To achieve a high degree of cleansing of a component to be cleansed by removing the foreign bodies adhering to the component to be treated by using supersonic vibration by a supersonic oscillator, and washing them away with a flowing treatment liquid. CONSTITUTION:A treatment bath 11 is provided with a liquid supply port 12 at one side thereof, and a discharge port 13 at the other side thereof. A supersonic oscillator 15 lowers at the time of cleansing, and the end portion of a phone portion 15a is located in water 14. A pusher can perform an operation such as rocking a wafer 16 to the right and left or feeding it. Holding the wafer 16 in a groove, the pusher 19 feeds it along the groove 17 of a guide 21 to the position below the end portion of the phone portion 15a of the supersonic oscillator 15, which lowered and was located. The water 14 vibrates up and down, applying vibration to the wafer 16. If the area of the portion of the phone portion 15a is small as compared with the surface are of the wafer 16, the pusher 19 rocks the wafer 16 to the right and left, thereby applying supersonic vibration to the surface thereof with a uniform strength. With this, the foreign bodies in holes are removed, and flowing water discharges from the discharge port 13 to the exterior of the treatment bath 11, thereby preventing the foreign bodies from re-adhering. |
