| 摘要 |
PURPOSE:To obtain sufficient electric connection readily, by providing spring action, which compresses the external leads of a semiconductor that is arranged at the bottom surface part of a lower socket from the outside, in plurality of contactors. CONSTITUTION:A recess part 28, which faces a bottom surface part 23 of a lower socket 28, is formed at the central part of the lower surface of an upper socket 22. On both sides of the recess part 28, a plurality of contactors 29a, 29b... are provided uprightly toward the bottom surface part 23. A plurality of the contactors 29a, 29b... are aligned at an interval corresponding to a plurality of external leads 13a, 13b... of a semiconductor device to be measured 11. The interval of the facing conductors 29a, 29b... is slightly narrower than the interval of the facing external leads 13a, 13b.... Spring repelling force is provided so as to resist outward expanding force. Thus, the external leads 13a, 13b... and the contactors 29a, 29b... are contacted in a sliding manner. Poor contact does not occur due to dust, contamination and the like at the contact surface. Thus the electric conducting state is ensured.
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