| 摘要 |
PURPOSE:To perform highly accurate position alignment with respect to a light beam and to perform attaching work readily, by forming position reference parts on a leadframe with the central line of an image element sensor chip as a reference. CONSTITUTION:An outer container is formed by laminating a leadframe 22, a substrate 25, a frame 26 and a bonding agent 28, by which they are bonded. An image sensor element chip 21 is mounted on the bed of the leadframe 22 through a mounting material 23, so that position deviation in the direction of Z is prevented. A position reference cut-out part 30 is formed in each extended part 22c from the center of the leadframe 22. The cut-out part is blanked on the extended line of a central line I of the image sensor element chip 21 after the image sensor element chip 21 is mounted. The cut-out parts 30 are used as references in the attaching work. Therefore, a position reference part is located at the correct position with respect to the image sensor element chip. Position deviation in the directions on an X-Y plane does not occur. With respect to the direction of Z, the leadframe is made to be the position reference. Therefore, accuracy of dimensional tolerance is obtained in the thickness of the film. |
