| 摘要 |
PURPOSE:To obtain a flat multilayer wiring in a simple process by filling the recession of a groove formed in an insulation film which is covered with a metal film on a substrate with an insulating resin which is stable in etching and heating, and removing the metal film other than on the groove. CONSTITUTION:An insulation film 2 is formed on a substrate 1 and a groove 3 is formed in the insulation film 2. The groove 3 is provided for wiring in it. Then, a metal film 4 is coated. In this case, even if the metal film 4 is coated, a recession 3' is formed at the position which corresponds to the groove 3. This is a step and is not flat. The recession 3' is buried with polyimide 5. Then, the metal film 4 is left only in the groove 3 and the other metal film 4 is removed so a flat wiring construction is obtained. |
