| 摘要 |
PURPOSE:To prevent contamination and damage of wafers and pellets by fixing with vacuum-sucking a wafer for diciding and plural pellets for collection on a fixed jig which has plural through holes. CONSTITUTION:A fixed jig 2 which can be attached or removed freely and has plural through holes 3 is installed on a dicing table 1. An O ring 4 is provided at the attaching and removing part, airtight is kept and a wafer 5 is placed where the through holes 3 are closed. An exhaust pipe 6 is provided at the side of the dicing table 1, the inside is exhausted and the wafer 5 is attracted on the dicing table 1 and fixed. A freely moving dicing saw 7 is provided at the top of the dicing table 1 and the wafer 5 is diced to a lattice. The diced wafer 5 is attracted on a collection table and inside of the which is made negative pressure with the fixed jig 2. A collect is provided at the top of the wafer 5 and a pellet is brought up to a required height with a needle, attracted, held and housed in a containing jig sequentially. |
