| 摘要 |
PURPOSE:To reduce bending, soldering short circuits and the like of external connecting terminals, by providing a twisted structure for the external connecting terminals, reinforcing the terminals, and substantially expanding an interval between the external connecting terminals. CONSTITUTION:Many leads 3 are protruded from outer surface of a package 2 constituting an IC1. The root part of each lead 3 is horizontal, but the outer part is twisted by about 90 degrees. Therefore, the tip part of the plate shaped body becomes the vertically upright state. In this structure of the leads 3, an interval between the leads 3 is substantially expanded. Therefore, the gap between wiring patterns 4 can be made large. Occurrence of soldering short circuits at the time of soldering dip can be decreased. At the twisted part, the lead 3 is hard to be deformed in the vertical direction and in the right and left directions, and the deformation of the lead 3 is decreased. |
