| 摘要 |
PURPOSE:To easily dissipate the heat of a substrate by a method wherein a fin is formed with the same material as the integral structure of good heat conducting material whereon a semiconductor is mounted, and it is directly fixed to a housing. CONSTITUTION:A ceramic package 5, wherein a heat conducting fin 4 is integral ly constructed, is directly fixed to a housing with a screw 6. As a result, the heat of the substrate can be dispersed from the housing 1 mainly by the heat conduction of the ceramic package 5. |
