| 摘要 |
PURPOSE:To prevent the defective soldering owing to the drippings and bridges formed in a soldered part in the stage of soldering with a jet soldering device having a wave regulating plate by oscillating ultrasonically the molten solder or a work on at least the ejection side of the work under movement or the work. CONSTITUTION:Part 11 of an oscillator is provided and the ultrasonic wave generated from the oscillator body is transmitted to the molten solder on the ejection side wave regulating plate 2c. The oscillator 11 may be provided on the rear side of the horizontal plate part of the plate 2c. The molten solder in tank 1 of such device is ejected from a nozzle 2 and falls into the tank 1 while the waves thereof are respectively regulated by the entry side and ejection side flow regulating plates 2b, 2c. A printed circuit board (a) which is the work subjected to flux coating, then to preheating is carried into the solder tank in the uphill state when the ultrasonic wave from the oscillator 11 is transmitted to the molten solder. The circuit board is brought successively into contact with the solder and is then detached therefrom. The cut end of the solder is oscillated during this time and therefore the solder is shaken off and the generation of the drippings and bridges is suppressed. |
