| 摘要 |
PURPOSE:To increase an etching speed and to decrease the fraction defective by subjecting a print board to etching while maintaining the board at the temp. higher than an etching liquid for etching a conductive layer to be formed as a wiring pattern. CONSTITUTION:The etching liquid is supplied to the print board in the form of a shower without heating the etching liquid and while the print board is kept heated to the temp. higher than the temp. of the etching liquid for etching the conductive layer to be formed as the wiring pattern in an etching method for forming the wiring pattern on the print board. The chemical reaction is thereby accelerated and the etching speed is increased as the etching speed in the vertical direction is dominant. The increased etching ratio between the vertical and horizontal directions and the decreased fraction defective are resulted therefrom. |
