发明名称 |
Clamping device for a plurality of wafer-shaped semiconductor components |
摘要 |
In the clamping device according to the invention, a cooling body (1) is provided with a planar face (1a, 1b), against which the wafer-shaped semiconductor components (4) bear. A pressure-applying body (5) made of elastic material bears on the semiconductor components (4). The pressure-applying body (5) is clamped against the cooling body (1) by means of a tensioning element (6). In order to facilitate fitting and maintenance of the semiconductor components, the tensioning element (6) is shaped like a plate and is attached to the cooling body (1) by means of a hinge joint (7). <IMAGE>
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申请公布号 |
DE3446569(A1) |
申请公布日期 |
1986.07.03 |
申请号 |
DE19843446569 |
申请日期 |
1984.12.20 |
申请人 |
SIEMENS AG |
发明人 |
BLIESNER,JUERGEN,ING.;GROSSMANN,KURT |
分类号 |
H01L23/40;(IPC1-7):H01L23/40 |
主分类号 |
H01L23/40 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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