| 摘要 |
<p>PURPOSE:To obtain a strong bending resistance by bonding an IC chip to a thin substrate with adhesives having a rubber elasticity, covering the periphery of the IC chip and bonding wire with a gel-state substance and thereafter, covering the periphery with a resin. CONSTITUTION:An IC chip 4 is bonded by die to a thin substrate 1 with rubber elasticity adhesives 2, and the bonding pad part is connected to a wire bonding pad part 3 by a bonding wire 5. The pad 3 is electrically connected through a wiring 3' to a terminal 3'. A frame 7 surrounds an area including a chip 4 and wire 5, a gel raw material is injected into an area surrounded by the frame 7 and a gel 6 is formed. The gel 6 is designed to protect a chip 4 and a wire 5 for the bending stress. A conductor rubber 8 is connected electrically to a terminal 3' with conductive adhesives 9. The rubber 8 has the same pattern as the pattern of the terminal 3'. After these chip 4, frame 7, gel 6 and rubber 8 are mounted and charged, the resin 10 is applied.</p> |
