| 摘要 |
PURPOSE:To obtain high coercive force and a high squareness ratio by forming continuously an Sn layer and magnetic metallic layer by vapor plating on a non-magnetic substrate. CONSTITUTION:A vapor deposition device 1 is disposed in a vacuum chamber 2 in such a manner that the non-magnetic substrate 3 travels between a supply reel 4 and a take-up reel 5. An Sn vapor deposition source 6 and a vapor deposition source for the magnetic metallic layer, for example, a vapor deposition source 7 of Co or Co-Ni are disposed to face the substrate 3. The vapor deposition sources 6, 7 are provided to extend to the substrate 3 side in such a manner that the evaporating materials are evaporated by the impact of the electron beams from an electron gun (not shown) and that the respective metallic flows from the sources 6, 7 are shielded from each other by a shielding plate 8. The substrate 3 is heated by a heating lamp 10. A thermocouple 10 connected to a temp. controller 12 maintains the substrate 3 at the prescribed temp. by a power source 13 for lamp controlled by a temp. controller. The Sn is first deposited by evaporation, then the magnetic metallic material is deposited by evaporation, by which the magnetic metallic layer is formed.
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