发明名称 SEMICONDUCTOR BONDING DEVICE
摘要 PURPOSE:To prevent a semiconductor device from being subjected to the effect of a charge storage phenomenon by a method wherein a charge is prevented from being stored on the wire ball forming part and the members of the semiconductor part. CONSTITUTION:An insulating member 4 and a conductive member 5 are pro vided under the lower surface of a torch 3 and the members 4 and 5 are earthed. For that, even when a high voltage is impressed in between the torch 3 and a wire 1 at the time of wire ball formation, a charge, which is stored on a semiconductor 7 by the voltage impressed, is immediately earthed. Moreover, when a conductive member 8 is provided on the upper surface of the semiconduc tor 7 and the conducture member B is earthed, even a finc voltage leaked can be eliminated. Furthermore, an irradiation 12 of ultraviolet rays or ozones is performed in between a bonding part 10 and a stoker 11 and a charge is erased. According to this constitution, a charge storage phenomenon to generate at the time of bonding can be prevented and the effect of the phenomenon to the semiconductor device can be prevented.
申请公布号 JPS61144836(A) 申请公布日期 1986.07.02
申请号 JP19840267683 申请日期 1984.12.19
申请人 SEIKO EPSON CORP 发明人 MOTOSAWA OSAMU
分类号 H01L21/60 主分类号 H01L21/60
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