| 摘要 |
<p>@ A dicing machine for cutting a semiconductor wafer (W) along cutting lines arranged in a lattice pattern. The dicing machine comprises a cutting station (2), at least one alignment station (4A, 4B), a cutting means (8) disposed in the cutting station, a detecting means (10A, 108) disposed in the alignment station for detecting the cutting lines of the water (W), and a wafer transferring means (6). The wafer transferring means includes two wafer supporting means (50A, 5;B) and the dicing machine is capable of positioning one of the two wafer supporting means in the alignment station and performing alignment of a semiconductor wafer (W) supported with said one of the wafer supporting means while positioning the other of the wafer supporting means in the cutting station and cutting a semiconductor wafer supported with said the other of the supporting means by the cutting means. The cutting means includes two cutting blades (158A, 158B) and a cutting blade interval setting-up means (122) for setting up the interval of these cutting blades.</p> |
