| 摘要 |
PURPOSE:To obtain the title resin which can give laminates excellent in soldering-heat resistance, by reacting a low-MW epoxy resin with a polyphenol in the presence of a catalyst and treating the product with an aqueous liquid. CONSTITUTION:A high-MW epoxy resin is obtained by reacting a low-MW epoxy resin [e.g., 2,2-bis(4-hydroxyphenyl) propane diglycidyl ether] with a polyphenol[e.g., 2,2-bis(4-hydroxy-phenyl) propane] at 120-200 deg.C in the presence of 0.0001-10wt.%, based on the low-MW epoxy resin, catalyst (e.g., NaOH) in, optionally, a solvent (e.g., xylene). This high-MW epoxy resin is dissolved, if required, in a solvent and contacted with an aqueous liquid which is water or an aqueous salt solution of a pH of 4-9 (e.g., aqueous solution of NaH2PO4) at room temperature -150 deg.C to obtain a highly pure epoxy resin.
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