发明名称 METHOD FOR MOUNTING OF SEMICONDUCTOR PELLET
摘要 PURPOSE:To prevent the element characteristics from differing exceedingly under the influence of positions of pellets by the pick-up mounting wherein plural semiconductor pellets arranged corresponding to the positions in a wafer are moved in parallel with zigzagging in order. CONSTITUTION:Plural semiconductor pellets 11a, 11b... in which luminous elements are formed in a wafer state are arranged on a sheet 12 corresponding to positions of the wafer. The predetermined number of semiconductor pellets 11a, 11b... within a range of n<1/2>/2 pieces - 2n<1/2> pieces of the number of necessary pellets (n=36) are picked up in a column direction or in a rank direction as shown by the arrow (a) and these are mounted on a substrate of display device which is not shown in drawings. Next, the pellets 11g, 11h... are moved in parallel by each rank in order as shown by the arrows b, c, d... and these are picked up to the necessary number of pellets for mounting. The necessary pellets are picked up from relatively adjacent positions in a wafer concentrically so that luminous characteristics do not differ exceedingly under the effect of positions of pellets.
申请公布号 JPS60258930(A) 申请公布日期 1985.12.20
申请号 JP19840114910 申请日期 1984.06.05
申请人 TOSHIBA KK 发明人 HORINOUCHI HIROSHI;KONNO KAZUTOSHI
分类号 H01L21/52;H01L21/58;(IPC1-7):H01L21/58 主分类号 H01L21/52
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