| 摘要 |
<p>PURPOSE:To prevent the optical losses such as absorption or diffusion of the light from an LED chip, etc., by a method wherein a circular frame is arranged on a substrate, with the LED chip bonded on the substrate as the center, and a resin material is dropped from above the LED chip to form a convex lens shaped with surface tention within the frame. CONSTITUTION:A circular and enclosing frame 4 is arranged on a substrate 2, with an LED chip 1, on which wire 3 is bonded, as the center. A resin material 5 is dropped from above the chip 1 to form a convex lens 6 on the chip 1 with the surface tention of the resin material 5 within the frame 4. The chip 1 is buried in the lens 6, with the result that the optical losses of absorption and deffusion of the light from the LED chip 1 because of the non-presence of an air layer between the chip 1 and the lens 6.</p> |
