| 摘要 |
PURPOSE:To obtain the titled composition of exceptionally enhanced heat resistance, free from generating bromine compound even during high-temperature storage, capable of giving highly reliable IC and LSI, by incorporating epoxy resin with a brominated resin and antimony oxide in a specific weight ratio. CONSTITUTION:The objective composition can be obtained by incorporating (A) an epoxy resin with (B) a brominated resin and (C) antimory oxide (e.g., antimony trioxide, antimony tetroxide) in such amounts as to satisfy the equations: b<=3.5, b>=3a and b>=-7a+5 where a (wt%) and b (wt%) are bromine content and antimony content in the final composition, respectively.
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