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发明名称
METHOD OF ASSEMBLING INTEGRATED CIRCUIT STRUCTURES IN HYBRIDE CIRCUIT ARRANGEMENTS AND ENCAPSULATION FOR AN INTEGRATED CIRCUIT STRUCTURE
摘要
申请公布号
PL251256(A1)
申请公布日期
1986.07.01
申请号
PL19840251256
申请日期
1984.12.24
申请人
OS BAD ROZWOJOWY MIKROELEKTRON
发明人
MAGONSKI ZBIGNIEW;BARAN KRZYSZTOF;ROMANSKI LESZEK;WAZNY JOZEF
分类号
H01L;(IPC1-7):H01L/
主分类号
H01L
代理机构
代理人
主权项
地址
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