发明名称 Molding device
摘要 One or more top-opening mold cavity defining members are supported in the chamber of a coolant box adapted for the flow of liquid coolant therethrough about the members. Each member is supported in a telescoping assembly in which the top opening of the member is co-axial with an opening in the top of the chamber to enable molten metal to be introduced to the cavity of the member through the respective top openings of the chamber and the member. Moreover, each member has a greater outer peripheral diameter transverse the axis than the top opening of the chamber, and is engaged with the top of the chamber about the opening thereof in a first horizontal plane of the box. The member is also engaged with the defining surfaces of the chamber in a second horizontal plane of the box spaced below the aforesaid first horizontal plane of the box by a vertical gap. Should liquid coolant leak into the gap through this second line of engagement, it is discharged from the gap at a level below the first horizontal plane of the box, and to a point outside of the chamber at which the leakage cannot reach the cavity of the member along the first mentioned line of engagement at the top of the chamber. As a result, the top opening of the chamber need only be large enough to enable the metal to be charged through the same, and the number of openings in the top of the chamber can be increased and/or spaced more closely to one another to maximize the number of molding stations in the device.
申请公布号 US4597432(A) 申请公布日期 1986.07.01
申请号 US19840618778 申请日期 1984.06.11
申请人 WAGSTAFF ENGINEERING, INC. 发明人 COLLINS, RICHARD J.;WAGSTAFF, FRANK E.;WAGSTAFF, WILLIAM G.
分类号 B22D11/049;B22D11/055;B22D11/124;(IPC1-7):B22D11/124 主分类号 B22D11/049
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