发明名称 EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR SEAING USE
摘要 PURPOSE:To obtain the titled composition of both high flame-retardancy and heat resistance, capable of giving highly reliable LSI, etc. even storage at elevated temperatures by incorporating epoxy resin with a phosphorus-modified flame-retarded resin. CONSTITUTION:The objective composition can be obtained by incorporating (A) an epoxy resin with (B) a phosphorus-modified epoxy resin having >=1wt% of phosphorus atom in the resin skeleton with an epoxy equivalent <=1,000g/eq and chlorine content <=2,000wt.ppm and/or (C) a phosphorus-modified phenolic resin having >=1wt% of phosphorus atom in the resin skeleton with a OH equivalent <=500g/eq in such amounts as to be >=0.4wt% and <=1wt% in the phosphorus atom and bramine in the final composition, respectively. Said phenolic resin is hydroxyphenol-based one with the impurities contained (esp. electrolytes) being pref. as little as possible.
申请公布号 JPS61143465(A) 申请公布日期 1986.07.01
申请号 JP19840265382 申请日期 1984.12.18
申请人 SUMITOMO BAKELITE CO LTD 发明人 KOSHIBE SHIGERU;KUROKI SHINICHI
分类号 C08G59/00;C08G59/20;C08G59/30;C08G59/32;C08G63/00;C08L63/00;H01L23/29;H01L23/31 主分类号 C08G59/00
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