| 摘要 |
PURPOSE:To attain rapid and highly accurate positioning by matching the 1st and 2nd patterns on the basis of the 1st key pattern signal obtained by an image pickup means and the 2nd key pattern signal obtained by turning the 1st key pattern signal by 90 deg.. CONSTITUTION:A semiconductor wafer 2 is held by a holding means 4 and the x, y and direction moving sources 16-18 of a moving means 12 are driven from a central processing unit through a movement driving means 72 to position the wafer 2 on a prescribed position. In this case, an image pickup means 38 consisting of the 1st and 2nd image pickup means 40, 42 for picking up an x-y matrix array formed on the surface of the wafer 2 through an optical means 26, a picture frame memory 48 for storing a signal outputted from the means 38 through a magnification converting means 44 and an A/D converting means 46, a key pattern memory 54 for storing the key pattern position signal indicating the key pattern of the wafer 2 and the 2nd key pattern position signal obtained by turning the 1st signal by 90 deg., and a pattern matching means 56 are formed to attain positioning on the basis of matching.
|
