| 摘要 |
PURPOSE:To prevent the contamination of a substrate on fixation and improve the flatness of the substrate after polishing by fixing the substrate to be polished onto a holder through the solidification of liquid. CONSTITUTION:A substrate 2 is fixed onto an upper plate 1 which can rotate, and coolant flows inside the upper plate. A lower plate 3 has a polishing cloth 4 attached onto the surface, and revolves with the substrate 2 mounted. A partitioning plate 5 has a hole for the insertion of the substrate as in the case of the carrier in the both-surface polishing. A receiving plate 6 receives polishing liquid. Therefore, when coolant is allowed to flow onto the holder 1, and the substrate 2 is fixed onto the holder 1 by the solidification of water, and a flat plate 3 is revolved, the holder 1 attached with the substrate 2 rotates, and the one-side surface of the substrate 2 is polished by supplying polishing liquid into between the polishing cloth 4 and the substrate 2. |
