发明名称 ENCLOSURE OF SEMICONDUCTOR DEVICE
摘要 <p>PURPOSE:To prevent a sealed part and adjoining parts thereof from being broken down by means of checking the stress of heat cycle with an engagement part by a method wherein flange parts are provided with an engagement part to make enclosure parts comprising the flange parts engage with each other. CONSTITUTION:The first enclosure 20 is composed of a dent hole 26 and a thin walled flange 27 extending from the opening side-wall ends of dent hole 26 to the outer sides thereof while the second enclosure part 21 is composed of an electrode 9 and another thin walled flange 29 extending from the central electrode 9 to the outer sides. A semiconductor pellet 7 is contained in a pellet container composed of the dent hole 26 of the first enclosure part 20 and the central part of the second enclosure part 21 blocking up the opening of dent hole 26. On the other hand, each of the enclosure parts 20, 21 make respective electrodes 8, 9 provided thereon adhere to both sides of the semiconductor pellet 7 while engaging protrusions 28, 30 with each other for assembling into a unit so that the peripheral part of flanges 27, 29 may be sealed by junctioning with e.g. cold pressure welding process.</p>
申请公布号 JPS61141161(A) 申请公布日期 1986.06.28
申请号 JP19840262969 申请日期 1984.12.14
申请人 TOSHIBA CORP 发明人 ARAKI YOICHI
分类号 H01L23/04;H01L21/50;H01L23/051 主分类号 H01L23/04
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