| 摘要 |
PURPOSE:To cool a semiconductor device with high reliability by mounting parallel elements connected in parallel with a semiconductor element in a liquid storage container and connecting the parallel elements via conductors passed through the heat transfer tube to an evaporator. CONSTITUTION:A semiconductor element 1 is pressed by an evaporator 6, and parallel elements 3 are connected via conductors 5 passed through an insulating tube 9A and bellows 9B forming a heat transfer tube 9 to the evaporator 6. The heat generated at the semiconductor element 1 is transferred to the evaporator 6 to boil cooling medium 12 making contact with the evaporator 6, the medium 12 thus becomes gaseous phase, the heat is thus transferred from the tube 9 to a container 7 and cooled at a condenser to be liquefied and returned to the original position. On the other hand, it is also cooled even at the parallel elements. Thus, airtight terminal or the like is not necessary in electric connection and it improves the reliability in the airtightness and cooling operation. |
