| 摘要 |
PURPOSE:To improve the heat-resistant hermetical property of the sealing structure of the titled device, by containing a sealing resin having a coefficient of expansion 2.0X10<-5> or less which seals a Cu lead-out member in the enclosure. CONSTITUTION:The lead-out member 1 leading out each lead of semiconductor elements 100a, 100b...100f is formed out of copper, and a sealing resin layer 2 used for a case sealing opening 102a is made of an expoxy resin of smaller coefficient of thermal expansion than general. The value of coefficient of resin expansion is small: 1.8X10<-5>, which is much closer to that of the sealing lead-out member 1 1.67X10<-5>. This enables the enclosure to be fully filled with sealing resin. |
