| 摘要 |
Moulding compositions based on polyamides, i.e. homopolyamides or copolyamides, having greatly reduced inherent adhesion, i.e. without the property of particles of the moulding compositions, in particular granules or powders, adhering to one another or forming clumps at elevated temperature, containing hydrophilic silicone compounds which are homogeneously miscible with the polyamides, added before, during or after the polymerisation in the melt-liquid state in amounts of from 0.005 to 5.00 % by weight.
|
