EPOXY RESIN COMPOSITION FOR SEALING SEMICONDUCTOR

摘要

PURPOSE:To obtain the titled epoxy resin composition having low stress without lowering the moisture resistance, and having improved moisture-resistance reliability as well as thermal shock resistance, by compounding a base epoxy resin with a polyolefin resin. CONSTITUTION:An epoxy resin is compounded with a polyolefin resin (e.g. silane-modified polyethylene resin) to obtain the objective composition. The amount of the polyolefin resin is preferably 1-30pts.(wt.) per 100pts. of the epoxy resin. The particle diameter of the polyolefin resin is preferably <=100mu.