| 摘要 |
PURPOSE:To prevent separation of a resin and a lead frame at an interface due to shearing force at the time of sealing and the like, by forming a Cu oxide film on the surface of the lead frame. CONSTITUTION:Copper (Cu) is plated on the surface of a lead frame part 1, which is sealed by a resin. Or the frame is heated in an oxygen atmosphere after the Cu plating, and a Cu oxide film is formed. The Cu film formed by the Cu plating or the Cu oxide film has excellent adhesion with the resin. Intrusion of moisture through the interface between the lead frame 1 and the resin is prevented. Since the Cu plated film or the Cu oxide film does not impair the solderability of Ag plating and the like, the film can be applied on the entire surface of the lead frame. Since the Cu plating is used, the cost can be made low. |
