| 摘要 |
PURPOSE:To obtain the titled compound useful as a curing agent effective to improve the heat-resistance and adhesivity of an epoxy resin, by removing the impurities from a reaction product of a bisphenol with formalin using a particular method, and reacting the product with a phenolic compound. CONSTITUTION:A bisphenol (e.g. bisphenol A) is made to react with formalin usually in the presence of an alkali metal hydroxide such as sodium hydroxide, preferably at 40-50 deg.C. The resultant 4-methylolated bisphenol is dissolved in an organic solvent (preferably methyl isobutyl ketone), and the solution is separated into the organic component and water. Formalin existing in the reaction product as a water-soluble impurity can be separated from the organic component by this process. The organic component is washed with pure water to effect the complete removal of formalin, and is made to react with a phenolic compound usually using oxalic acid as a catalyst to obtain the objective compound.
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