| 摘要 |
PURPOSE:To improve thermal fatigue characteristics, moisture resistance and shock resistance, by electrically connecting a connecting terminal to a plurality of semiconductor pellets, which are mounted on a pellet mounting conductor, connecting the connecting terminal to a terminal conductor on a substrate, and guiding the terminal to the outside. CONSTITUTION:The specified part of a connecting terminal 27 is connected to a heat radiating substrate 20 through a solder layer 28, a terminal conductor 24 and an insulating layer 22 sequentially. Thus the difference in thermal capacity between the surface of a semiconductor pellet 26 on the side of the heat radiating substrate and the surface of the pellet on the side of the connecting terminal 27 can be made sufficiently small. As a result, occurrence of cracks in the solder layers 25 and 28 can be prevented during a thermal fatigue test. The connecting terminal 27 is connected to the terminal conductor 24 before the terminal 27 reaches the semiconductor pellet 26. Therefore, the actual length of the connecting terminal 27 can be made long, and the intrusion of moisture to the semiconductor pellet 26 can be suppressed. External force is absorbed by the connecting part of the terminal conductor 24, and shock resistance can be improved. |
