| 摘要 |
PURPOSE:To prevent a wafer holding tape from being cut in its shaped portions, by fixing the locally heated tape by suction in a recessed mold formed in a vacuum head and shaping the same without applying any mechanical force thereto. CONSTITUTION:A pressure increasing chamber 30 is lowered under control to be pressed against the outer periphery of a vacuum head 21 so as to grasp the ends of a tape 11 therebetween. A heater 27 is then lowered under control such that heating pieces 28 thereof are contacted with the tape shaping portions corresponding to the edges of a recess 22. The tape shaping portions are thereby locally heated sufficiently. The heater 27 is then removed from the tape 11 while pressurized air is injected from an air supply tube 29 as indicated by the arrows. The central portion of the tape 11 is thereby deflected downward from the shaped portions and along the recess 22 in the vacuum head 21. Thus, the tape 11 is contacted with a wafer 12. |
