发明名称 HEAT SINK METAL PACKAGE
摘要 PURPOSE:To obtain a package having excellent heat sink and airtightness by engaging a terminal mounted with a ceramic insulator metallized on the outer cylinder with the terminal hole of the body of a metal flat pack type package of high thermal conductivity. CONSTITUTION:A pin 6 and a ceramic 5 are sealed with glass 7 or the hole of the ceramic 5 is metallized at 8', braked at 9 and bonded. The outside of the hole of a package body 1 is chamfered at 3, spot faced at 3', hermetically braked uniformly and readily. According to this configuration, a package having simple manufacture and low cost can be obtained.
申请公布号 JPS61137350(A) 申请公布日期 1986.06.25
申请号 JP19840260372 申请日期 1984.12.10
申请人 NEC CORP 发明人 SAITO YUKIO;ISONO AKIRA;HATAKI KAZUO;AIHARA SHIGENOBU
分类号 H01L23/34;H01L23/06;H01L23/10 主分类号 H01L23/34
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