| 摘要 |
PURPOSE:To obtain a resin-sealed semiconductor device having excellent moisture resistance by projecting at least wire bonding portion of a lead frame by drawing in a protruded shape with respect to the upper surface. CONSTITUTION:The other end of an inner lead 3 bent at one end downward and externally exposed is opposed to a semiconductor element 7 secured to a tab 1, and electrode wirings formed at the semiconductor element 7 are connected by connector wirings 8 with the lead 3. In this configuration, a projection 10 projected upward by drawing is formed at a wire bonding portion of the lead 3, and wirings 8 are secured by a supersonic bonding method. Then, the element 7, the wirings 8 and the projection 10 of the end of the lead 3 are contained as usual, and sealed with resin 11. Thus, the occupying area of the leads can be reduced, the resin 11 is not separated by the difference of thermal expansion coefficients, and the moisture resistance of the device can be enhanced. |
