| 摘要 |
PURPOSE:To prevent the clinging adhesion of the adhesion substance such as dust or foreign matter onto a conductor layer, by continuously forming a hard layer and a conductor layer onto the conductor layer in a film form. CONSTITUTION:Tantalum is applied to a glazed alumina substrate of which the surface is convered with a glaze layer 3 by the reactive sputtering of argon Ar and nitrogen N2 to form a heat generating resistor layer 4 of Ta2N. Next, an Al-conductor pattern part 5 is formed to said resistor layer 4 by sputtering and a hard layer 2 comprising tantalum nitride Ta2N is further formed to said pattern part 5 by reactive sputtering. These layers are continuously formed in a vacuum state by a three-target sputtering apparatus. The pattern of this thermal head is formed by etching. Next, a protective layer 9 consisting of an oxidation resistant layer 6 and an abrasion resistant layer 7 is formed. Be cause three layers are continuously formed as mentioned above, the adhesion substance such as dust or foreign matter is not adhered onto the hard Al conduc tor layer 5 to enable the formation of the dust preventing hard layer 12. |
