发明名称 WAFER PROCESSING APPARATUS
摘要 PURPOSE:To prevent exfoliation of photoresist from the periphery and lower generation of foreign matter, by providing a means for exposing the periphery of wafer. CONSTITUTION:A wafer 1 transferred to a prealignment part 4 from a loader 2 with an arm 3 is exposed from the upper side with a laser or ultraviolet ray generator 10. Thereby, the photoresist 11a coated thick to the rear surface from the periphery of wafer 1 by a rotatable coating method is removed at the time of developing process and it can be assuredly prevented that the photoresist 11a is partly exfoliated in the etching process 6 to become foreign matter.
申请公布号 JPS61137320(A) 申请公布日期 1986.06.25
申请号 JP19840259140 申请日期 1984.12.10
申请人 HITACHI LTD 发明人 CHIBA TADAHIDE;ASANAMI KENICHI
分类号 H01L21/027;G03F7/20;H01L21/30 主分类号 H01L21/027
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