摘要 |
PURPOSE:To prevent exfoliation of photoresist from the periphery and lower generation of foreign matter, by providing a means for exposing the periphery of wafer. CONSTITUTION:A wafer 1 transferred to a prealignment part 4 from a loader 2 with an arm 3 is exposed from the upper side with a laser or ultraviolet ray generator 10. Thereby, the photoresist 11a coated thick to the rear surface from the periphery of wafer 1 by a rotatable coating method is removed at the time of developing process and it can be assuredly prevented that the photoresist 11a is partly exfoliated in the etching process 6 to become foreign matter. |