| 摘要 |
PURPOSE:To increase a degree of freedom of pad arrangement and reduce the height of sealing resin to increase flexibility, by loading a connecting pad of semiconductor element on the substrate surface while causing it to face the aperture of flexible substrate and connecting a substrate and pad of element through the aperture. CONSTITUTION:The surface of IC chip 4 is placed opposing to the rear surface of a flexible substrate 1 and a connecting pad 6 is placed facing to the substrate aperture 7 and it is bonded. A connecting pad 3 of substrate 1 and the pad 6 of chip 4 are connected with a wire 8 extended through the aperture 7. Next, the front surface of substrate 1 and the rear surface of chip 4 are sealed with epoxy resin 9, 10. According to this structure, the wire 8 can be shortened, an excessive stress is not generated on the wire on the occasion of resin sealing or deformation of substrate and thereby disconnection of wire and partial exfoliation of junction are not generated. Moreover, a part of pad of substrate 1 can be arranged on the element mounting surface, a degree of freedom in arrangement is high and height of sealing resin h can be reduced, thus improving flexibility. |
