| 摘要 |
PURPOSE:To reduce the bearing work of a thin film magnetic head sharply and to improve mass-productivity by adjacently arraying different patterns necessary for bearing to constitute a wafer for a thin film magnetic head. CONSTITUTION:In the wafer 6 for the thin film magnetic head, respective thin film head elements 2 are two-dimensionally and regularly arranged (20X25 elements in a 2-inch square) and the gap azimuth angles of respective elements are alternately changed in the positive and negative directions in each string. If it is supposed that the front direction of the drawing is a head sliding surface, the string of A1-An... is negative azimuth (-theta) elements and the string of B1-Bn... is positive azimuth (+theta) elements. The dispersion of head characteristics in the wafer substrate is extremely low between adjacent chips, so that efficient bearing can be automatically obtained by combining these adjacent chips. |
