发明名称 TAKING-OUT TRANSFERRING APPARATUS FOR SEMICONDUCTOR WAFERS
摘要 PURPOSE:To transfer a workpiece in stable state by eliminating the state where the worked surface of the workpiece is broken or contaminated, by supporting the workpiece only on the side edges and the edge lines and nipping the workpiece by an optimum pressure. CONSTITUTION:At a work taking-out position, an endless belt 3 is driven in the direction for shortening the interval between work catching tools 4 and 5, and the both edges of a work W are nipped by the work catching tools 4 and 5. Though the load current I of a motor 6 sharply increases at this time, said electric current is restricted in an electric-current restriction instruction circuit, and the work W is certainly held by a proper nipping force of the work catching tools 4 and 5. A work holder 1 shifts to a work release position, holding the work W by the transfer instruction of the work holder 1. Since the work W is supported only the side edges W1 and W2 of the work and the edge lines L1 and L2 of the bottom surface, and the worked surface such as the top surface and bottom surface of the work W does not contact with an article, the trouble of breakage and dirt during the process starting from taking- out to the release of work W is obviated.
申请公布号 JPS61136841(A) 申请公布日期 1986.06.24
申请号 JP19840255482 申请日期 1984.12.03
申请人 M T C:KK 发明人 TAMAKI TAKEO
分类号 B65H5/10;B65G1/00;B65G1/07;B65G47/82;B65G49/07;B65G59/06;B65H1/28;B65H3/00;B65H3/34;B65H5/14 主分类号 B65H5/10
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