| 摘要 |
PURPOSE:To perform semiconductor sealing process by welding shell automatically and efficiently without fail by means of equipping the titled device with a carrier mechanism, a shell feeder, a chuck mechanism and a welding robot. CONSTITUTION:A preheating chamber 1 able to be sealed is continuously connected to the inlet of a processing chamber 4. The processing chamber 4 is equipped with a lifting mechanism 10 lifting or lowering magazine by one pitch, a pusher 25 pushing out a board in the magazine, carrier mechanisms 28, 29 jointly provided on the side of board feeding the board by one pitch with a pawl engaging with a hanging hole, a shell feeder 62 feeding a shell by one pitch to a gauging stand 63, a chuck mechanism holding the device floating on the board and rocking it by 90 deg. in case of welding process, a welding robot 59 attracting and carrying a shell to a welding position for welding and another lifting mechanism 64 lifting or lowering a magazine by one pitch.
|
