| 摘要 |
PURPOSE:To prevent any crack from generating in the ceramic substrate and the semiconductor pellets by a method wherein a thermal strain absorbing sheet is made to interpose between the land part of the lead frame and the wiring substrate. CONSTITUTION:A sheet 10 is one that an insulating material having heat resistance and flexibility is molded in a thin film sheet form. The sheet 10 is made to interpose between a ceramic substrate 1 and the land part 6a of a lead frame 6, three members of the ceramic substrate 1', the sheet 10 and the land part 6a are thermally press welded and the ceramic substrate 1' is adhered on the land part 6a. The sheet 10 acts as a buffer material to enable a difference between the thermal expansion coefficients of the ceramic substrate 1' and the land part 6a to reduce and the sheet 10 prevents it for a crack to generate in the ceramic substrate 1' or such electronic parts as semiconductor pellets 3. 3'... at the molding time of a mold with an enclosing resin or at the time of heat shock test. |
