| 摘要 |
PURPOSE:To keep hermetic properties by covering the surface of a metallic layer of an outer surface of the container which is connected with the lead which is given a ground potential out of the leads and the part of sealing alloy for sealing the container with a cap with the ceramic thin film. CONSTITUTION:Leads 2 are formed at the bottom of a container 8 and the leads 2 are connected with the elements such as a FET attached in the inside through the through holes. Among the leads, one that is connected to a source electrode and is given a ground potential is connected by a metallized layer 3 on the outer surface of the container 8 up to its upper end. This metallized layer 3 is for preventing a resonance when the cap 4 or the sealing alloy 1 is straying electrically. The center of the metallized layer 3 is coated with a ceramic layer 5 having a thickness of about 50mum. By comprising the ceramic layer 5, a solder 7 is prevented from rising along the metallized layer 3 when the main package is mounted on a printed circuit board or a microwave circuit by soldering. Then the defects such that a hole is made on the sealing alloy 1 or the hermetic properties is deteriorated with aging can be solved. |
