| 摘要 |
PURPOSE:To enable a solder paste printing method by dividing a semiconductor pellet and a discrete part into a plurality of regions on a wiring substrate and preventing the mixing of elements according to mounting systems of two kinds in one region. CONSTITUTION:Semiconductor pellets 2 form one region and discrete parts 3 and 4 shape another region on a wiring substrate 1. Consequently, the semiconductor pellets 2 are coated with a resin 5, and region solder paste for the discrete parts 3 and 4 can be printed. That is, the semiconductor pellets and the discrete part are each isolated, thus enabling a solder paste printing method, then manufacturing a hybrid integrated circuit device having high reliability. |
