| 发明名称 |
ENCAPSULATION MOLD WITH GATE PLATE AND METHOD OF USING SAME |
| 摘要 |
The appts. is partic. used for encapsulating semiconductor chips while reducing the amt. of resin wasted in extensive distribution systems and eliminating any requirement for ejector pins. The encapsulated devices are lifted from the cavity plate structure by the action of a flexible gate plate and removed from the gate plate by bending it. |
| 申请公布号 |
KR860000763(B1) |
申请公布日期 |
1986.06.23 |
| 申请号 |
KR19840000054 |
申请日期 |
1984.01.09 |
| 申请人 |
DUSAN TOOLS INC. |
发明人 |
SLEPSEVIC, DUSAN |
| 分类号 |
B29B7/00;B29C39/00;B29C39/06;B29C39/10;B29C39/36;B29C43/00;B29C45/00;B29C45/02;B29C45/14;B29C45/26;B29C45/38;B29C63/00;H01C13/00;H01L21/56;(IPC1-7):B29C63/00 |
主分类号 |
B29B7/00 |
| 代理机构 |
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代理人 |
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| 地址 |
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