| 摘要 |
PURPOSE:To facilitate assembly of various kind of package by a method wherein an electrode section near by a corner section of a semmiconductor chip is connected so as to use as an electrode section of different signal in accordance with kind to package. CONSTITUTION:A bonding wire 5, a semiconductor chip 11, 11' disposed on an electrode section 12a-12e, 12a'-12e' and a conductor section 13a-13d 13a'-13d' on a package at one corner section at the time when the semiconductor chip 11, 11' is assembled by the same package 3, 6 as conventinoal. If it is checked that which of the electrode sections 12a-12e, 12'a-12'e it is used for signal, the signals of the electrode sections at the same position are different by the semiconductor chip 11, 11'. That is, the electrode section 12a and 12b of the semiconductor chip 1 is connected to signal phi1 and phi2 respectively and 12c is unused terminal, on the other hand, 12'a is unused terminal and 12'b and 12'c are used to signal phi1 and phi2 respectively at the semiconductor chip 11'. In this mannr, short cut caused by contact of the bonding wire does not happen. |
