| 摘要 |
PURPOSE:To enable common use independently of the difference in the number of continuous connection, and to reduce the number of ascent-descent times of dies and bending bases, by a method wherein dies and bending bases are arranged each by 2N+1 pieces at equal pitches with respect to the minimum number N of continuous connection of the titled devices. CONSTITUTION:In the case of separating semiconductor devices from a lead frame with the continuous connection of the minimum number N of semiconductor devices and of bending leads, the minimum number N of the lead frame connections are stored each in two magazines 13a and 13b, and these magazines 13a and 13b are set up in front of the lower dies 11. At the time of this set-up, the lower die 11b and upper die, the lower bending die and upper bending die which are located at the center are put in the state out of use. Lead frames are taken out of each magazine 13a, 13b by operating feed pawls 15. A lead frame is positioned and fixed on the lower die, and semiconductor devices are separated from the lead frame by lowering the upper die. Then, each semiconductor device is fed onto the lower bending base by the feed pawls, and leads of the semiconductor device are bent downward by lowering the upper bending base.
|
