| 摘要 |
PURPOSE:To prevent the deterioration in moisture resistance by a method wherein the middle part of an outer lead terminal drawn out of the sealed resin body is provided with a projection formed by bending. CONSTITUTION:The middle part of an outer lead terminal 2 drawn out of the sealed resin body 1 is provided with an inward projection 3 formed by partial recess through bending with a mold at the step of a lead frame 11 in which leads are attached and assembled to the semiconductor element. At the time of mounting such a semiconductor device on a printed circuit board, the conventional impact on outer lead terminals is absorbed by the projection provided at the middle part of the outer lead terminal. |
