发明名称 SEMICONDUCTOR COMPOUND ELEMENT
摘要 <p>PURPOSE:To alleviate design restriction, by making the surface of an electrode having a control electrode of a semiconductor element to face a metallic connecting body, fixing the electrode between both parts, and providing an opening part, through which a lead wire for the control electrode is taken out sideward, at said electrode. CONSTITUTION:A thyristor chip 14 is assembled so that the cathode surface having a gate electrode, which is a control electrode, faces downward. Of electrode molybdenum parts 13 and 15 at the upper and lower sides of the chip 14, the cathode molybdenum part 15 is provided at the lower side of the chip 14. A hole 15, through which a gate lead 17 is inserted, is provided at the center of the molybdenum part 15. An opening part 18a through which the gate lead 17 is taken out sideward, is provided in a cathode electrode 18. The cathode electrode 18 is inserted between the cathode molybdenum part 15 and a metallic connecting layer 12. The gate lead 17 is covered by an insulating flexible tape 17 in order to prevent contact between the gate lead 17 and a cathode electrode 18.</p>
申请公布号 JPS61133653(A) 申请公布日期 1986.06.20
申请号 JP19840256189 申请日期 1984.12.03
申请人 MITSUBISHI ELECTRIC CORP 发明人 YAMAMOTO TAKESHI
分类号 H01L25/07;H01L23/051;H01L25/18 主分类号 H01L25/07
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